A Model of Learning Technology Partnership with Vendors: A Systematic Process

Autor/inn/en	Jung, Eulho; Zheng, Hua; Webster, Nick; Hamad, Adonis; Demir, Fatih; Kim, Dongho
Titel	A Model of Learning Technology Partnership with Vendors: A Systematic Process
Quelle	In: Contemporary Educational Technology, 13 (2021) 4, S.321 (19 Seiten)Infoseite zur Zeitschrift PDF als Volltext kostenfreie Datei Verfügbarkeit
Zusatzinformation	ORCID (Jung, Eulho) ORCID (Zheng, Hua) ORCID (Webster, Nick) ORCID (Hamad, Adonis) ORCID (Demir, Fatih) ORCID (Kim, Dongho)
Sprache	englisch
Dokumenttyp	gedruckt; online; Zeitschriftenaufsatz
ISSN	1309-517X
Schlagwörter	Universities; Technology Integration; Educational Technology; Vendors; Partnerships in Education; Program Implementation; Program Evaluation; Learning Analytics; Outcomes of Education + Suchen Sie Ihr Suchwort? University; Universität; Unterrichtsmedien; Vendor; Anbieter; Hochschulpartnerschaft; Programme evaluation; Programmevaluation; Lernleistung; Schulerfolg
Abstract	Higher education institutions partner with technology providers to stay competitive in the fast-evolving innovations of technological advancements. The purpose of this study is to reflect on and investigate technology integration cases at a mid-sized public university in the U.S. Taking a qualitative research approach, this study utilizes critical reflection and multiple case studies (Stake, 2006). After reviewing the data, a technology partnership model was created that is composed of five phases: (1) analysis, (2) negotiation, (3) pre-implementation, (4) implementation, and (5) evaluation. The findings indicate that a systematic process must be utilized to ensure efficiency in vendor-university partnerships. Discussions, limitations, and implementation are provided. (As Provided).
Anmerkungen	Contemporary Educational Technology. Faculty of Communication Sciences, Anadolu University, Yunus Emre Campus, Eskisehir 26470, Turkey. e-mail: editor@cedtech.net; Web site: http://www.cedtech.net
Erfasst von	ERIC (Education Resources Information Center), Washington, DC
Update	2024/1/01