A Profile of the Engineering Profession.

Autor/in	Alden, John D.
Institution	Engineers Joint Council, New York, NY. Engineering Manpower Commission.
Titel	A Profile of the Engineering Profession.
Quelle	(1971), (36 Seiten) PDF als Volltext kostenfreie Datei Verfügbarkeit
Dokumenttyp	gedruckt; online; Monographie
Schlagwörter	Employment; Employment Patterns; Engineering Education; Engineers; Geographic Distribution; National Surveys; Specialization + Suchen Sie Ihr Suchwort? Dienstverhältnis; Beschäftigungsstruktur; Ingenieurausbildung; Arbeitsteilige Spezialisierung
Abstract	This report is based on data obtained during the summer of 1969 from 45,000 fully qualified engineers, representing an estimated 308,00 members of the organized engineering profession. The following statements summarize the findings of this study. The largest number of degrees were reported in the fields of electrical and electronic, mechanical, and civil engineering respectively. Among 199 areas of technology, 34 percent of the engineers selected the following eight as the areas in which they were most competent: engineering generally, mechanical engineering, electrical engineering, structures, systems engineering, industrial engineering, electronic applications, and plant and facilities engineering. Of the qualified respondents who were employed, most were in three major sectors of the economy: 72 percent in industry, 14 percent in government, and 7 percent in educational institutions. Fifteen percent of the qualified respondents regarded themselves as other than engineers, even though they met the criteria to be counted as engineers for purposes of the survey. Forty-three percent of the qualified respondents were licensed in one or more states. Less than one half of one percent of the group were women. The two states with the largest number of engineers were California with 13 percent and New York with 9 percent. (Author/PR)
Anmerkungen	Engineers Joint Council, 345 East 47th Street, New York, New York 10017 ($1.00)
Erfasst von	ERIC (Education Resources Information Center), Washington, DC
Update	2004/1/01