Literaturnachweis - Detailanzeige
Autor/inn/en | Shin, Hyojung; Lee, Jayoung; Kim, Boyoung; Lee, Sang Min |
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Titel | Students' Perceptions of Parental Bonding Styles and Their Academic Burnout |
Quelle | In: Asia Pacific Education Review, 13 (2012) 3, S.509-517 (9 Seiten)Infoseite zur Zeitschrift
PDF als Volltext |
Sprache | englisch |
Dokumenttyp | gedruckt; online; Zeitschriftenaufsatz |
ISSN | 1598-1037 |
DOI | 10.1007/s12564-012-9218-9 |
Schlagwörter | Adolescents; Student Attitudes; Parent Child Relationship; Burnout; Student Surveys; Asians; Foreign Countries; Middle School Students; Measures (Individuals); Multivariate Analysis; Parenting Styles; Scores; Academic Achievement; South Korea; Maslach Burnout Inventory Adolescent; Adolescence; Adoleszenz; Jugend; Jugendalter; Jugendlicher; Schülerverhalten; Parents-child relationship; Parent-child-relation; Parent-child relationship; Eltern-Kind-Beziehung; Burn out (Psychology); Burnout-syndrom; Burnout-Syndrom; Schülerbefragung; Asian; Asiat; Asiatin; Asiaten; Asiate; Ausland; Middle school; Middle schools; Student; Students; Mittelschule; Mittelstufenschule; Schüler; Schülerin; Messdaten; Multivariate Analyse; Schulleistung; Korea; Republik |
Abstract | This study investigated how parental bonding style affects academic burnout in Korean adolescents. Participants were 447 middle school students, who completed the Parental Bonding Instrument and the Maslach Burnout Inventory-Student Survey. MANCOVA results confirmed that adolescents reporting the optimal bonding parental style, for both mother and father, have lower scores on three subscales of academic burnout (Exhaustion, Cynicism, and Inefficacy) than do their counterparts who report the affectionless control parental style. We discuss the possible implications for reducing students' academic burnout rates. (As Provided). |
Anmerkungen | Springer. 233 Spring Street, New York, NY 10013. Tel: 800-777-4643; Tel: 212-460-1500; Fax: 212-348-4505; e-mail: service-ny@springer.com; Web site: http://www.springerlink.com |
Erfasst von | ERIC (Education Resources Information Center), Washington, DC |
Update | 2017/4/10 |